Heat dissipation structure for processors
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United States of America Patent
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N/A
Issued Date -
Sep 20, 2007
app pub date -
Jun 7, 2006
filing date -
Mar 17, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heat dissipation structure for processors to disperse heat from a plurality of processors located on a main board includes a fastening element and a heat dissipator. The fastening element has a plurality of engaging members located on the main board corresponding to the processors. The heat dissipator is made of fine heat conductor and includes a radiator, a plurality of engaging portions and a plurality of coupling portions. The engaging portions correspond to the fastening element. The coupling portions correspond to the processors. The engaging portions of the heat dissipator are coupled with the corresponding engaging members of the fastening element and the coupling portions are in contact with the corresponding processors.
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