Composition for forming insulating layer and insulating film

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United States of America Patent

APP PUB NO 20070213502A1
SERIAL NO

11715932

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Such a composition for forming an insulating layer improved in insulating property is to be obtained. A composition for forming an insulating layer of an electronic device is provided, and the composition contains at least one polymer selected from a polyamic acid and a derivative of a polyamic acid, and a compound having a functional group capable of reacting with a carboxyl group contained in a constitutional unit of the polymer.

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Patent Owner(s)

Patent OwnerAddress
JNC CORPORATION2-1 OTEMACHI 2-CHOME CHIYODA-KU TOKYO 1008105 ?1008105

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kondo, Fumitaka Chiba, JP 37 256
Ootaniuchi, Yuuko Chiba, JP 1 1

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  • 1 Citation Count
  • C08G Class
  • 10.62 % this patent is cited more than
  • 18 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1136531835626884331601 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050100150200250300350400450500550600650700

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