Composition for forming insulating layer and insulating film
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United States of America Patent
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Issued Date -
Sep 13, 2007
app pub date -
Mar 9, 2007
filing date -
Mar 9, 2006
priority date (Note) -
Abandoned
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Abstract
Such a composition for forming an insulating layer improved in insulating property is to be obtained. A composition for forming an insulating layer of an electronic device is provided, and the composition contains at least one polymer selected from a polyamic acid and a derivative of a polyamic acid, and a compound having a functional group capable of reacting with a carboxyl group contained in a constitutional unit of the polymer.
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