RFID Smart Label with Reduced Layers and Method of Production
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
Sep 13, 2007
app pub date -
Mar 6, 2007
filing date -
Mar 10, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An RFID smart label includes a plurality of layers, wherein one of the plurality of layers is an RFID inlay with a depression/recession region for holding the RFID chip/strap so that it does not extend above the surface of the antenna. The depressed/recessed region can have substantially the same depth as the thickness of the RFID chip/strap. High speed printing processes are then used to economically print labels on the RFID inlays having the RFID chip/strap embedded because there are no bumps to impede the printing process. A method for reliably and economically manufacturing a radiofrequency identification (RFID) antenna includes impressing a pattern on a surface of a substrate to make a first portion of the substrate having a positive image of the RFID antenna and a second portion of the substrate having a negative image of the RFID antenna, applying a release agent on the second portion of the substrate having a negative image of the RFID antenna, depositing a metallization layer over the surface of the substrate, applying a solvent over the metallization layer, and scraping the surface of the substrate causing mechanical interruption of the metallization layer. The release agent can be masking materials containing TiO.sub.2 or oil.
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