Method and apparatus for curing epoxy-based photoresist using a continuously varying temperature profile
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United States of America Patent
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Issued Date -
Sep 6, 2007
app pub date -
Mar 1, 2006
filing date -
Mar 1, 2006
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Abandoned
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Abstract
A method for curing an epoxy-based photoresist uses a continuously varying temperature profile, to continuously raise the kinetic energy of the monomers involved in the curing process, allowing them to cross-link. By using the continuously varying temperature profile, the maximum temperature to achieve a more completely cured film is reduced, as is the total processing time. In addition, curing using the continuously varying temperature profile is a single step method, rather than a multi-step method of the prior art, significantly simplifying the process flow for producing the cured structures. The cured structures may have mechanical properties which render them suitable as functional elements of various MEMS devices, including rigid, dielectric tethers used in MEMS thermal switches, for example.
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