Method for stamping an embossment on ribbon

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20070205536A1
SERIAL NO

11433444

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for stamping an embossment on ribbon is provided. First, a ribbon is employed as a substrate. Then, at least one layer of plastic-material covers the substrate. A drum emboss calender machine, which has patterns on the roller, is applied to stamp the embossment on the ribbon. Finally, the continuous or discontinuous embossment can be stamped on the ribbon by using the drum emboss calender machine. The embossed ribbon can be provided with various styles and features, and can enhance the visual impression.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN PAIHO LIMITEDCHANG HWA HSIEN

International Classification(s)

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  • 2006 Application Filing Year
  • B29C Class
  • 1789 Applications Filed
  • 905 Patents Issued To-Date
  • 50.59 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20062007200820092010201120122013201420152016201720182019202020210255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Sen-Mei Ho Mei Town, TW 37 256

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Patent Citation Ranking

  • 0 Citation Count
  • B29C Class
  • 0 % this patent is cited more than
  • 18 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges496302468031159432301 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 90100 +050100150200250300350400450500550600650700

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