Liquid dispense system
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United States of America Patent
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Issued Date -
Sep 6, 2007
app pub date -
Mar 3, 2006
filing date -
Mar 3, 2006
priority date (Note) -
Abandoned
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Abstract
The present invention provides a system, apparatus and method for supplying liquid through a dispensing loop to tools requiring such liquid. In particular, the present invention provides a system, apparatus and method for supplying liquid or slurry to CMP (chemical mechanical polishing) tools of a semiconductor manufacturing process. In accordance with the present invention, the liquid is delivered at a consistent flow rate and pressure to the tools, by controlling the flow rate and pressure through the use of pumps combined with flow or pressure sensors in the dispense loop.
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