Magnetron based wafer processing

United States of America Patent

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Issued Date
Sep 6, 2007
app pub date
Mar 6, 2006
filing date
Mar 6, 2006

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Abandoned

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Abstract

A wafer magnetron includes a support for supporting a wafer; a generator to provide an electric field substantially perpendicular to the wafer surface; and a magnet system for generating a magnetic field, a portion of the magnetic field lines being parallel to the wafer surface.

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Patent Owner(s)

Patent Owner	Address
4D-S PTY LTD	C/-LEVEL 21 QVC 1 BUILDING 250 ST GEORGE'S TCE PERTH 6000

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C23C:COATING METALLIC MATERIAL; COATING MATERIAL WITH M....

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Inventor Name	Address	# of filed Patents	Total Citations
Nagashima, Makoto	Tokyo, JP	64	693

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Magnetron based wafer processing

Number of patents in Portfolio can not be more than 2000

United States of America Patent

11369164

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11369164

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