Package structure for a solar chip
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United States of America Patent
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Issued Date -
Sep 6, 2007
app pub date -
Mar 2, 2006
filing date -
Mar 2, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention discloses a high-efficiency light-focusing package structure for a solar chip, which includes: a solar-chip sustaining substrate, a pair of positive-electrode and negative-electrode lead frames, and a covering. The covering may focus sunlight and also has an anti-reflective function to promote sunlight absorption. Further, the package structure for a solar chip of the present invention is low-cost and can be designed and assembled according to the size and shape required by a user.
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