PIEZOELECTRIC THIN FILM DEVICE
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United States of America Patent
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Issued Date -
Aug 30, 2007
app pub date -
Feb 16, 2007
filing date -
Feb 24, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention is directed to preventing characteristic variations and damage caused by a difference in thermal expansion coefficient. A piezoelectric thin film filter, including four film bulk acoustic resonators, has a configuration where a filter section for providing a filter function of the piezoelectric thin film filter is bonded with a flat base substrate mechanically supporting the filter section via an adhesive layer. In manufacturing of the piezoelectric thin film filter, a piezoelectric thin film is obtained by performing removal processing on a piezoelectric substrate that can individually stand up under its own weight, but substrates made of one kind of single crystal material are adopted as the base substrate and the piezoelectric substrate, to make the respective thermal expansion coefficients of the piezoelectric thin film and the base substrate coincident with each other.
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