FLIP-CHIP LED PACKAGE AND LED CHIP
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United States of America Patent
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Issued Date -
Aug 30, 2007
app pub date -
Feb 26, 2006
filing date -
Feb 26, 2006
priority date (Note) -
Abandoned
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Abstract
A light emitting diode (LED) chip mainly includes a substrate, a first type doped semiconductor layer, light-emitting layers, second type doped semiconductor layers, a first electrode and second electrodes. The first type doped semiconductor layer is disposed on the substrate and includes protrusions which is upward extended; the light-emitting layers are disposed on the corresponding protrusions respectively; the second type doped semiconductor layers are disposed on the corresponding light-emitting layers respectively; the first electrode is disposed on the first type doped semiconductor layer except the protrusions and electrically connected to the first type doped semiconductor layer; the second electrodes are disposed on the corresponding second type doped semiconductor layers respectively; and the first electrode is electrically insulated from the second electrodes.
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