Flip chip in package using flexible and removable leadframe
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
Aug 23, 2007
app pub date -
Feb 21, 2006
filing date -
Feb 21, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for forming semiconductor packages is disclosed. The method involves providing a support substrate and forming at least one conductive layer thereon. The method also includes coupling the at least one conductive layer to a support face of a film substrate for securing the at least one conductive layer to the support face and removing the support substrate from the at least one conductive layer. The at least one interconnector is adhered to the film substrate for forming an interposer. The method further involves bonding a integrated circuit chip to the at least one conductive layer of the interposer and disposing a compound over the support face to thereby encapsulate the integrated circuit chip and the least one conductive layer for forming an encapsulated package therefrom. Portions of the at least one conductive layer is then exposed by removing the film substrate from the encapsulated package.
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