Silicon inertial sensors formed using MEMS
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United States of America Patent
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Jan 27, 2009
Grant Date -
Aug 23, 2007
app pub date -
Sep 30, 2005
filing date -
Sep 30, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A MEMS silicon inertial sensor formed of a mass that is supported and constrained to vibrate in only specified ways. The sensors can be separately optimized from the support, to adjust the sensitivity separate from the bandwidth. The sensor can sense three dimensionally, or can only sense in a single plane.
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