Mechanical property measurement of thin films by micro plane-strain compression
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United States of America Patent
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Jul 8, 2008
Grant Date -
Aug 16, 2007
app pub date -
Nov 21, 2006
filing date -
Nov 21, 2005
priority date (Note) -
Expired
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Abstract
This invention is directed to the measurement of stress-strain relationships in thin films using substantially flat, parallel test surfaces with minimal width. This invention is further directed to the measurement of stress-strain relationships in thin films at controlled temperatures and at high strain rates above 100% per second.
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