Moisture cure adhesive for bonding structural wood
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United States of America Patent
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Issued Date -
Aug 9, 2007
app pub date -
Feb 7, 2006
filing date -
Feb 7, 2006
priority date (Note) -
Abandoned
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Abstract
The invention is directed to a moisture cure adhesive composition for bonding structural wood substrates. The composition includes a moisture curable isocyanate terminated polyurethane prepolymer that is a reaction product of an aliphatic polyol component, an aromatic polyol component, and an aromatic isocyanate component. The composition exhibits an extremely high heat resistance at 180.degree. C.
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