Laminating resin with reduced styrene monomer
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United States of America Patent
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Issued Date -
Aug 2, 2007
app pub date -
Jan 30, 2006
filing date -
Jan 30, 2006
priority date (Note) -
Abandoned
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Abstract
A laminating resin having low styrene content is provided. The resin includes a thermosetting resin and a reactive intermediate including a low molecular weight polyester oligomer endcapped with at least one (meth)acrylic acid, its ester or its anhydride thereof.
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