Flame-retarding and thermosetting resin composition
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United States of America Patent
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Issued Date -
Aug 2, 2007
app pub date -
Jun 29, 2006
filing date -
Jan 27, 2006
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a thermosetting resin composition, which comprises at least one titanium compound copolymerized composite as filler and can be used as mechanical, electrical and electronic parts, molded and/or packaging resin for semiconductor and so on, etc. By adding such titanium compound copolymerized composite, the resin composition of the present invention improves flame retardance and heat resistance and has an excellent moldability and reliance under circumstances without adding any other flame-resisting material.
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