Solder paste inspection system and method
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United States of America Patent
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N/A
Issued Date -
Aug 2, 2007
app pub date -
Jan 31, 2006
filing date -
Jan 31, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A solder paste inspection machine carries out the steps of automatically generating inspection data for solder paste deposits, automatically determining a squeegee direction of travel for said paste deposits. It associates the squeegee direction with the inspection data, and feeds the inspection data back to a solder paste printer with an indication of squeegee direction. The direction is determined from three-dimensional range maps, the direction of squeegee travel being in the direction of upward slope.
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