Structure for integrating LED circuit onto heat-dissipation substrate
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United States of America Patent
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Issued Date -
Aug 2, 2007
app pub date -
Jan 27, 2006
filing date -
Jan 27, 2006
priority date (Note) -
Abandoned
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Abstract
A structure for integrating LED circuit onto a heat-dissipation substrate is disclosed. At least an electronic component and a LED chip are integrated on a heat-dissipation substrate. The electronic component can be a passive component, a drive chip, an electrostatic discharge protection device, or a sensing component. Therefore, both wire-bonding area of the LED chip and the series resistance of wires are reduced while the heat dissipation efficiency is enhanced.
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