ELECTROLESS GOLD PLATING SOLUTION AND METHOD
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United States of America Patent
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Issued Date -
Aug 2, 2007
app pub date -
Dec 5, 2006
filing date -
Feb 1, 2006
priority date (Note) -
Abandoned
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Abstract
Electroless gold plating compositions that include an adhesion enhancer compound and a reduction accelerator are provided to obtain direct electroless gold plating over a gold, nickel or nickel alloy deposit. A method of electroless gold plating on a nickel-containing substrate is also disclosed.
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