Method for fabricating bipolar integrated circuits
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United States of America Patent
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Issued Date -
Jul 26, 2007
app pub date -
Jan 23, 2006
filing date -
Jan 23, 2006
priority date (Note) -
Abandoned
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Abstract
The present invention discloses a method for fabricating bipolar integrated circuits, wherein LOCOS technology is used to define the active regions needed by all elements so that the self-alignment of the associated layers can be realized, and implant resistor regions are also directly defined in the active regions by local oxide layers; after base regions have been driven in the wafer, the resistors are implanted into the wafer so that the cost of resistor photomasks can be saved; silicon nitride is adopted to be the material of the dielectric layers of the capacitors, and with the characteristic of a buffering oxide etchant that etches oxide faster than it etches silicon nitride, the conventional deposition sequence of the dielectric layer is changed so that the formation of the dielectric layer needs only a single photomask.
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