Sample preparation method including cooling and cutting
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United States of America Patent
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N/A
Issued Date -
Jul 19, 2007
app pub date -
Jul 9, 2003
filing date -
Jul 12, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to the provision of a compound preparation method and apparatus which can be used to prepare a compound or sample for a further analytical or reactive process. Preferably the present invention may be adapted to cool the compound in question to increase its rigidity and to subsequently allow for the mechanical processing of the compound to render it into a plurality of particles or components of substantially the same size.
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