Electronic package including an electromagnetic shield
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United States of America Patent
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N/A
Issued Date -
Jul 19, 2007
app pub date -
Jan 19, 2006
filing date -
Jan 19, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
One embodiment of n electromagnetically shielded electronic package includes a substrate having an exposed surface, a grounding structure at least partially exposed on the exposed surface and at least one electrical component positioned on the exposed surface, a conductive structure secured to the exposed surface and in contact with the grounding structure, a non-conductive layer formed on the exposed surface and covering the at least one electrical component and at least partially covering the conductive structure, and a conductive layer formed on the non-conductive layer and in contact with the conductive structure.
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