Electronic package including an electromagnetic shield
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jul 19, 2007
app pub date -
Jan 19, 2006
filing date -
Jan 19, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
|
US Family Size
|
Non-US Coverage
|
Abstract
One embodiment of n electromagnetically shielded electronic package includes a substrate having an exposed surface, a grounding structure at least partially exposed on the exposed surface and at least one electrical component positioned on the exposed surface, a conductive structure secured to the exposed surface and in contact with the grounding structure, a non-conductive layer formed on the exposed surface and covering the at least one electrical component and at least partially covering the conductive structure, and a conductive layer formed on the non-conductive layer and in contact with the conductive structure.
First Claim
Other Claims data not available
Family
- No Family data available.
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
- 41 Citation Count
- H05K Class
- 81.51 % this patent is cited more than
- 18 Age