Method and apparatus for thermal management of computer memory modules

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United States of America Patent

PATENT NO 7738252
APP PUB NO 20070159789A1
SERIAL NO

11621396

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Abstract

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A heat spreader and method for thermal management of a computer memory module by promoting natural convection cooling of the memory module. The heat spreader includes a frame surrounding a planar body adapted to be mounted to a memory module of a computer, and a grid defined in the planar body by a plurality of uniformly distributed perforations. The perforations extend through the planar body to allow natural convention between an interior space beneath the planar body and an exterior space above the planar body.

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nelson, Eric L Rancho Palos Verdes, US 26 781
Petersen, Ryan M Sunnyvale, US 13 246
Schuette, Franz Michael Colorado Springs, US 73 2786
Sethi, Bhulinder Sunnyvale, US 2 59

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