Packaging structure for radio frequency identification devices
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United States of America Patent
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Issued Date -
Jul 12, 2007
app pub date -
Jan 9, 2007
filing date -
Jan 9, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A packaging structure for a radio frequency identification (RFID) device is disclosed which comprises a substrate, an antenna with a plurality of terminals formed on the substrate, a RFID chip with a plurality of signal pins electrically coupled to the plurality of terminals, respectively, and a plurality of thermally activated binding pads being electrically conductive and in contact with the plurality of signal pins, respectively, wherein the RFID chip is adhered to the substrate by the plurality of binding pads after a thermo-pressing process.
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