Structure and method for packaging radio frequency identification devices
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United States of America Patent
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Issued Date -
Jul 12, 2007
app pub date -
Jan 9, 2007
filing date -
Jan 9, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A structure for packaging a radio frequency identification (RFID) device is disclosed, which comprises a substrate, an antenna formed on the substrate, a RFID chip with a first side attached to the substrate and a second side having at least one signal pin exposed, at least one conductive contact plate placed on the substrate in contact with both the exposed signal pin and a portion of the antenna, and a protective film over the contact plate to secure the same to the substrate, wherein an electrical connection between the signal pin and the portion of the antenna is made through the contact plate.
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