High-voltage thick-film high rupturing capacity substrate fuse

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20070159291A1
SERIAL NO

10557532

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Abstract

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The subject of the invention is a high-voltage thick-film high rupturing capacity substrate fuse. The characteristic feature of the inventive fuse is that inside a tubular insulating casing /1/, which is closed at both ends with metal endocarps /2/ and filled with arc quenching medium /3/ there is located at least one insulating substrate /4/, along which there is placed at least one fuse element /5/ in the form of a thin conducting film and which has terminal areas /6/ at its ends, which areas are electrically connected with the end-caps by specially shaped contacts /7/ located inside the end-caps. The fuse element comprises a basic part formed by multiple identical V-shaped modules and two end modules forming electric connections between the basic part and the terminal areas. In each module, the arms of the V shape, of a specific width, end with arches directed outwards /8/, which arches are connected with the arches of the arms of the neighboring modules by means of line segments, thus forming a line, which bends many times at a constant angle and has truncated vertices in each module, in which line at least one module contains at least one edge constriction /9/, enabling opening of the current path when the fuse is overloaded.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hoffmann, Guido Wettingen, CH 10 100
Kaltenborn, Uwe Regensburg, DE 17 124
Kaltenegger, Kurt Lengnau, CH 19 176
Wilniewczyc, Marius Warszawa-Wesola, PL 1 9

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