Memory packaging structure of mini SD card
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United States of America Patent
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N/A
Issued Date -
Jul 12, 2007
app pub date -
Nov 24, 2006
filing date -
Jan 4, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A memory packaging structure of mini SD card, the main implementation technology thereof comprises: to perform the pin adjustment to the: memory originally employing TSOP (Thin Small Out-Line Package) packaging structure, eliminating the gap of 0.1 mm to 0.2 mm between the memory and the circuit board, thus completely attached to the circuit board; to leave the top end of the mini SD card open to directly expose the top end of the memory on the surface of the mini SD card, reducing the thickness of a layer of coverage; to cover the pins on the both sides of the memory to hind them, wherein applying glue joint between the auxiliary lateral body and memory pins to enhance the attachment.
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