CARRIER STRUCTURE FOR SEMICONDUCTOR PACKAGE
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United States of America Patent
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-
N/A
Issued Date -
Jul 12, 2007
app pub date -
Oct 2, 2006
filing date -
Dec 30, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An exemplary carrier structure (20) for carrying workpieces includes a body (23) and an adhesive tape (27). The body defines a receiving hole (21) therethrough for receiving one or more of the workpieces therein. The adhesive tape is attached to one side of the body and covers the receiving hole thereby allowing one or more of the workpieces to be received in the receiving hole and on the adhesive tape.
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