Dispersion for the chemical-mechanical polishing of metal surfaces containing metal oxide particles and a cationic polymer
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United States of America Patent
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Issued Date -
Jul 12, 2007
app pub date -
Mar 16, 2005
filing date -
Apr 3, 2004
priority date (Note) -
Abandoned
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Abstract
Aqueous dispersion for the chemical-mechanical polishing of metal surfaces, containing a metal oxide powder and a cationic, surface-active polymer, wherein the metal oxide powder is silicon dioxide, aluminium oxide or a mixed oxide of silicon dioxide and aluminium oxide, and the cationic, surface-active polymer is a polyallyl amine or polydiallyl amine dissolved in the dispersion and having a weight average molecular weight of less than 100,000 g/mol. The dispersion can be used for the chemical-mechanical polishing of metallic layers and of metallic films, which are applied to an insulating barrier layer.
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