HEATER FOR DEPOSITING THIN FILM
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United States of America Patent
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N/A
Issued Date -
Jul 5, 2007
app pub date -
Nov 29, 2006
filing date -
Dec 31, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heater for depositing a thin film to deposit a thin film on a seated wafer by heating is provided. The heater for depositing a thin film includes: a wafer supporting plate on which a wafer is seated and a plurality of injection holes are disposed at the edge of the wafer supporting plate and in which a heat generating member is included; a shaft disposed at the lower side of the wafer supporting plate which comprises an inert gas pathway through which inert gas is provided; and a flow channel forming cover bonded to the lower part of the wafer supporting plate, and comprising an inner space formed between the flow channel forming cover and the wafer supporting plate, wherein the injection holes and the inert gas pathway are connected via the inner space.
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