SUBSTRATE WITH MULTI-LAYER INTERCONNECTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Jun 28, 2007
app pub date -
Mar 31, 2006
filing date -
Dec 22, 2005
priority date (Note) -
Abandoned
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Abstract
The invention provides a substrate with multi-layer interconnection structure, which includes a substrate and a multi-layer interconnection structure formed on the substrate. The multi-layer interconnection structure is adhered to the substrate in partial areas. The invention also provides a method of manufacturing and recycling such substrate and a method of packaging electronic devices by using such substrate. The invention also provides a method of manufacturing multi-layer interconnection devices.
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