Die attachment method for LED chip and structure thereof
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United States of America Patent
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Issued Date -
Jun 21, 2007
app pub date -
Dec 20, 2005
filing date -
Dec 20, 2005
priority date (Note) -
Abandoned
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Abstract
A die attachment method for LED chips and the structure thereof are disclosed. While attaching a LED chip to a substrate, surface of two bonding material is ionized by ultrasonic waves so as to make the attachment of a LED chip to a substrate is under low temperature operating condition and having better heat dissipation structure.
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