Electronic member fabricating method and ic chip with adhesive material
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United States of America Patent
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Issued Date -
Jun 14, 2007
app pub date -
Oct 7, 2004
filing date -
Oct 7, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention includes: an adhesive material attaching process for attaching a wafer to a thermoseffing adhesive material provided on a base film; a dicing-film attaching process for attaching the base film to a dicing film; an IC-chip separating process for cutting the wafer and the thermosetting adhesive material to divide them into IC chips; and a mounting process for attaching, to a carrier, the IC chips having the thermosetting adhesive material attached thereto; wherein the thermosetting adhesive material has a viscosity of 20000 Pas or less at the attaching temperature during the adhesive material attaching process.
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