Electronics assembly machine with embedded solder paste inspection
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United States of America Patent
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app pub date -
Oct 31, 2006
filing date -
Oct 31, 2005
priority date (Note) -
Abandoned
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Abstract
A pick and place machine includes a placement head configured to releasably grasp a component for placement. A robotic system is coupled to the placement head to generate relative movement between the placement head and a workpiece. An image acquisition system is configured to acquire at least one image of an intended placement location of the component before the component is placed. A controller is operably coupled to the image acquisition system, the controller is configured to process at least one before-placement image to generate a metric relative to solder deposited at the intended placement location.
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