CAPILLARY FOR A BONDING TOOL

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United States of America Patent

SERIAL NO

11567331

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A capillary is provided for a wire bonding tool that comprises a holding portion for clamping the capillary, a conical portion at a tip of the capillary for performing bonding and a substantially frustoconical portion located between the holding portion and the conical portion. The sidewalls of the frustoconical portion form an interfacial angle that is smaller than an interfacial angle formed by the sidewalls of the conical portion so as to provide a gentle taper from the holding portion to the conical portion.

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Patent Owner(s)

Patent OwnerAddress
ASM TECHNOLOGY SINGAPORE PTE LTDSINGAPORE SHUN SHUN ROAD 2 NO 7 SINGAPORE CITY SINGAPORE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LIM, Loon Aik Singapore, SG 4 76
NARASIMALU, Srikanth Singapore, SG 31 176
YING, Ning Singapore, SG 5 20

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