PSEUDOELASTIC POROUS SHAPE MEMORY MATERIALS FOR BIOMEDICAL AND ENGINEERING APPLICATIONS

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United States of America Patent

APP PUB NO 20070123976A1
SERIAL NO

11534275

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Abstract

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New porous shape memory materials with the use of different fabrication methods such as hot isostatic pressing technique are provided for biomedical and engineering applications. These new materials have a pseudoelasticity ranging from 0.1% to 50%. The mechanical properties of those materials can be adjusted from 1% to 10%. The pore distribution of these said materials is isotropic and homogenous, and their pore shapes can be tailor-made to be spherical or polygonal as avoiding stress concentration around the pores. The porosity and pore size can be controlled by fabrication process. These materials can exhibit superior pseudoelasticity and mechanical properties during testing than the other porous shape memory alloys fabricated by Self-propagating High-temperature Synthesis (SHS). These advance properties may apply to but not only limited to orthopaedic implants such as artificial bone graft, hip prosthesis and interverbal disc prosthesis; and also for engineering purpose such as damping devices.

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Patent Owner(s)

Patent OwnerAddress
VERSITECH LIMITED100 CYBERPORT ROAD ROOM 405A CYBERPORT 4 HONG KONG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheung, Kenneth Man Chee Mid-Levois, HK 9 69
Chung, Chi Yuen Hong Kong, HK 5 31
Yee, Ho Joan Pui Yuen Long, HK 1 1
Yeung, Kelvin Wai Kwok Tai Wnl, HK 7 66
Yuan, Bin TianHe, CN 74 115
Zhu, Min TianHe, CN 244 15096

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