Processing liquid coating apparatus and a processing liquid coating method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
May 31, 2007
app pub date -
Oct 27, 2004
filing date -
Oct 31, 2003
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention relates to a processing liquid coating apparatus and a processing liquid coating method suitable for use in a lithography process for forming fine circuit patterns on a surface of a substrate such as a semiconductor wafer. The processing liquid coating apparatus according to the present invention includes a substrate holder (1) for holing and rotating a substrate (W), and a processing liquid supply unit (2) disposed apart from the substrate (w) held by the substrate holder (1). The processing liquid supply unit (2) has a plurality of supply ports (5, 6) for supplying a processing liquid to a plurality of portions including a central portion (C) of a surface of the substrate (W). A resist liquid or a developer is used as the processing liquid.
First Claim
Other Claims data not available