Apparatus incorporating small-feature-size and large-feature-size components and method for making same
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United States of America Patent
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app pub date -
Jan 16, 2007
filing date -
Jan 23, 2002
priority date (Note) -
Abandoned
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Abstract
An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.
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