Integrated Circuit Micro-Cooler with Double-Sided Tubes of a CNT Array
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United States of America Patent
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app pub date -
Sep 18, 2006
filing date -
Aug 24, 2004
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Abstract
Heat sink structures employing carbon nanotube or nanowire arrays exposed from both opposite surfaces of the structure to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. In one embodiment, the nanotubes are cut to essentially the same length over the surface of the structure. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface with high axial and lateral thermal conductivities.
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