Systems And Methods For Forming Integrated Circuit Components Having Matching Geometries
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United States of America Patent
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app pub date -
Jan 12, 2007
filing date -
Jul 15, 2004
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Abandoned
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Abstract
In a particular embodiment, a method of forming integrated circuit components is provided. A first photomask is formed, the first photomask including a first mask component having a first geometry corresponding to a first type of integrated circuit component. A first lithography process is performed to transfer the first geometry of the first mask component of the first photomask to a first location on a first die on a semiconductor wafer to form a first integrated circuit component of the first type of integrated circuit component on the first die. A second lithography process is performed to transfer the first geometry of the first mask component of the first photomask to a second location on the first die on the semiconductor wafer to form a second integrated circuit component of the first type of integrated circuit component on the first die.
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