Image sensor chip package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
May 17, 2007
app pub date -
Sep 22, 2006
filing date -
Nov 16, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An image sensor chip package (200) includes a carrier (20), an image sensor chip (30), a number of wires (50) and a holder (60). The carrier includes a base (21) and a leadframe (23) embedded in the base. The base includes a board (211), a sidewall (213) and a cavity (24). The leadframe includes a plurality of conductive leads (233) spaced from each other. Each lead has a first terminal portion (236), and an interconnecting portion (237) connecting the first and second terminal portions. The chip is mounted on the carrier, and has an active area (301) and a number of contacts (302). The wires electrically connect the contacts of the chip and the first terminal portions of the leadframe. The holder is mounted to the carrier to close the cavity, and allows light to pass therethrough to reach the active area of the chip.
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