Packaging methods
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United States of America Patent
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Issued Date -
May 10, 2007
app pub date -
Feb 6, 2006
filing date -
Nov 10, 2005
priority date (Note) -
Abandoned
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Abstract
Packaging method. The method includes providing a conductive substrate comprising top and bottom surfaces, forming a first circuit layer of a package substrate and then packaging an active device overlying the top surface, and forming other circuit layers and a contact pad of the package substrate overlying the bottom surface.
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