Packaging with a break line and method for manufacturing the same
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United States of America Patent
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Issued Date -
May 10, 2007
app pub date -
Aug 10, 2006
filing date -
Aug 12, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention is directed to packaging comprising a multiple-layer material construction with a break line which is formed by a line-shaped, successive arrangement of blind holes separated by webs and in which the multiple-layer material construction comprises at least one layer which absorbs laser radiation and a layer which reflects this laser radiation. A radiation-absorbing layer forms the surface layer of the packaging, and the blind holes of the surface layer extend into the packaging until the reflecting layer, and the web widths are substantially constant over the depths of the blind holes so that there are abrupt jumps in material thickness along the break line, and a clearly audible noise is generated when these jumps in material thickness are overcome when the break line tears. The invention is further directed to a method for producing packaging of this kind.
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