Method and apparatus for establishing optimal thermal contact between opposing surfaces
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United States of America Patent
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Issued Date -
May 3, 2007
app pub date -
Nov 1, 2005
filing date -
Nov 1, 2005
priority date (Note) -
Abandoned
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Abstract
To achieve optimal thermal contact between opposing surfaces, it is necessary to align such surfaces so that maximum contact is achieved. In a semiconductor package, it is necessary to align the surface of a semiconductor integrated circuit (IC) and a heat sink surface, where the heat sink contains a nano-composite wire structure. By using a self-aligned structure that forces the alignment of the IC surface and the heat sink, maximum thermal contact between the two surfaces is achieved. The self-alignment of a pressure measurement device for same is also disclosed.
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