Selective reactive ion etching of wafers

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United States of America Patent

SERIAL NO

11642049

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Abstract

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The invention comprises a device for assisting in the selective reactive ion etching of wafers comprising, a graphite base plate including an opening for housing a wafer, and a plurality of graphite strips that can be arranged over the graphite base plate to select a site of a wafer housed in the base plate for etching.

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Patent Owner(s)

Patent OwnerAddress
SYSTEMS ON SILICON MANUFACTURING CO PTD LTD70 PASIR RIS DRIVE 1 SINGAPORE 519527

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tong, Tan Kok Dover Close East, SG 2 0
Ye, Sim Kwang Jalan Membina, SG 2 0

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