Method for the structured metal-coating of polymeric and ceramic support materials, and compound that can be activated and is used in said method
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United States of America Patent
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Issued Date -
Apr 26, 2007
app pub date -
Jun 4, 2004
filing date -
Jun 5, 2003
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Abandoned
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Abstract
The invention is directed to a method for producing highly adhesive conductive structures on nonconductive substrates, in particular for application in electric circuits, and to a surface-activating compound for use in the method. The method comprises the following method steps: application and selective irradiation of a surface-activating compound, and subsequent electroless metallization of the irradiated areas to form metallic structures.
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