Semiconductor module including a plurality of IC chips therein
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United States of America Patent
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N/A
Issued Date -
Apr 26, 2007
app pub date -
Oct 19, 2006
filing date -
Oct 20, 2005
priority date (Note) -
Abandoned
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Abstract
A semiconductor module includes a driver IC chip and a plurality of memory IC chips on a common wiring board. Some of the memory IC chips nearer to the driver IC chip than the other memory IC chips are mounted on an interposer substrate mounted on the wiring board, providing a uniform line length among a species of signal lines for the memory IC chips.
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