Method of making a circuitized substrate having a plurality of solder connection sites thereon
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United States of America Patent
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app pub date -
Oct 20, 2005
filing date -
Oct 20, 2005
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Abandoned
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Abstract
A method of making a circuitized substrate in which solder material (e.g., in paste form) is deposited through a screen onto individual conductors in a spaced pattern of individual solder 'islands'. A solder flux is then deposited onto the 'islands' causing these to spread out and form a continuous solder layer across the conductor's upper surface. The solder layer is then capable of coupling to an external conductor such as a solder ball, to form an electrical assembly such as might be used within an information handling system such as a personal computer.
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