Envelope having improved overlap profile
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
N/A
app pub date -
Oct 11, 2006
filing date -
Oct 3, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An envelope assembly is provided for improved performance of a mailing envelope in the automated mail handling process. The envelope comprises a front panel having top, bottom and side edges and forming an envelope front surface, side flaps extending front the side edges, a rear panel extending from the bottom edge and combining with the side flaps to form an envelope rear surface, and a closure flap extending from the top edge for securing the envelope in a closed position. The configuration and attachment of the side flaps and the rear panel are especially beneficial as described herein.
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