LED light source module with high efficiency heat dissipation
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United States of America Patent
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Issued Date -
Apr 12, 2007
app pub date -
Oct 7, 2005
filing date -
Oct 7, 2005
priority date (Note) -
Abandoned
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Abstract
The present invention provides an LED light source module design featured with efficient heat dissipation. This invention comprises a printed circuit board of thickness less than 400 .mu.m, installed with an LED array which is composed of multiple high powers, super bright emitter LEDs. The thinner version of the printed circuit provides shorter route for faster thermal conductivity; and thus promotes the efficiency for heat dissipation. With its bendable flexibility, the thinner version of the printed circuit board can accommodate and well affix to the inner side of any shape of lighting fixture rack. This further enhances the heat dissipation for varieties of lighting fixture rack design.
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